Pai-Yen Chen named a University Scholar

Pai-Yen Chen

Associate Professor Pai-Yen Chen was named a University Scholar for 2024-2025. The Office of the President sponsors the University Scholars program. It provides a three-year award to faculty members who “have demonstrated superior performance in scholarly activities in both research and teaching and who show great promise for future achievements.”

Earlier this year, Chen, who joined UIC in 2018, received the 2023-24 UIC Researcher of the Year Award from the Office of the Vice Chancellor for Research, in the Natural Sciences and Engineering category. The Rising Star Award is presented to individuals who show exceptional promise to become future leaders.

“I am delighted and honored to be named the University Scholar, and I consider this a great recognition of all the hard work and dedication of my team and myself during the decade of my academic journey,” Chen said.

Chen conducts multidisciplinary research on applied electromagnetics, RF and microwave antennas and circuits, wireless sensors and systems, nanophotonics and nanoelectronics, and quantum information science and engineering, or QISE.

Chen has received several outside honors, including an IEEE Sensors Council Young Professional Award and Union Radio Scientifique Internationale (URSI) Young Scientist Award in 2017, a 2018 National Science Foundation CAREER Award, a SPIE Rising Researcher Award in 2018, the IEEE Raj Mittra Travel Grant (RMTG) Award in 2018, an Applied Computational Electromagnetics Society (ACES) Early Career Award in 2019, and he was named an IOP Emerging Leader in Measurement Science and Technology in 2021. This year, Chen was appointed a Distinguished Lecturer of the Institute of Electronic and Electrical Engineers (IEEE) Sensors Council for 2024 through 2026.

Chen has five concurrent grants totaling approximately $2 million. He is actively recruiting graduate students in electromagnetics and radio-frequency integrated circuits to explore emerging topics such as antenna-on-chip/antenna-in-package using IPD, TSV and HDI-PCB technologies, 3D IC heterogenous integration, device-circuit co-design, silicon photonics, hardware-based cryptography, flexible electronics, non-Hermitian wave systems, and quantum electrodynamics in his research group.