Chen receives 2024 IEEE Sensors Council Technical Achievement Award
Chen receives 2024 IEEE Sensors Council Technical Achievement Award Heading link
Associate Professor Pai-Yen Chen is the recipient of the 2024 Institute of Electrical and Electronics Engineers, or IEEE, Sensors Council Technical Achievement Award in Sensor Systems or Networks – Advanced Career. The technical achievement award is considered the highest technical honor offered by IEEE.
The award is for Chen’s “contributions to theory, development, and practical implementation of RF, microwave, optical, and acoustic sensors.”
The award honors a person with outstanding technical contributions, as documented by publications and patents, based on the general quality and originality of contributions. The winner of this award is presented with a plaque and $2,000. Chen will be presented with this honor at IEEE SENSORS 2024 in Kobe, Japan, in October.
“I am truly honored to receive such high praise from IEEE, and it is an even greater honor to be placed in the advanced career rank,” Chen said.
Chen, who joined UIC in 2018, conducts multidisciplinary research on applied electromagnetics, RF and microwave antennas and circuits, wireless sensors and systems, nanophotonics, nanoelectronics, and quantum information science and engineering, or QISE.
Chen has received several outside honors, including an IEEE Sensors Council Young Professional Award and Union Radio Scientifique Internationale (URSI) Young Scientist Award in 2017, a 2018 National Science Foundation CAREER Award, a SPIE Rising Researcher Award in 2018, the IEEE Raj Mittra Travel Grant (RMTG) Award in 2018, an Applied Computational Electromagnetics Society (ACES) Early Career Award in 2019, and he was named an IOP Emerging Leader in Measurement Science and Technology in 2021. This year, Chen was appointed a Distinguished Lecturer of the Institute of Electronic and Electrical Engineers (IEEE) Sensors Council for 2024 through 2026.
Chen has five concurrent grants totaling approximately $2 million. He is actively recruiting graduate students in electromagnetics and radio-frequency integrated circuits to explore emerging topics such as antenna-on-chip/antenna-in-package using IPD, TSV and HDI-PCB technologies, 3D IC heterogenous integration, device-circuit co-design, silicon photonics, hardware-based cryptography, flexible electronics, non-Hermitian wave systems, and quantum electrodynamics in his research group.