Your browser is unsupported

We recommend using the latest version of IE11, Edge, Chrome, Firefox or Safari.

Sep 24 2021

Silicon-based Millimeter-wave Phased Arrays for 5G: Fundamentals to Future Trends

ECE 595 Department Seminar Series

September 24, 2021

11:00 AM - 12:15 PM




Chicago, IL 60607

Silicon-based Millimeter-wave Phased Arrays for 5G: Fundamentals to Future Trends

Presenter: Bodhisatwa Sadhu, IBM T. J. Watson Research Center

Abstract: 5G cellular communications use millimeter-wave phased arrays to achieve high data rates and low latency. The majority of the 5G millimeter-wave infrastructure will be partially or completely based on silicon technology. This talk will discuss key aspects of silicon-based millimeter-wave phased-array module design and characterization. It will cover fundamentals of phased arrays, provide an overview of phased array antenna modules using silicon technology, and take a deep dive into an example 5G phased array antenna module. The talk will end with a peek into the future of 5G directional communications.

Speaker Bio: Bodhisatwa Sadhu received his B.E. degree in electrical and electronics engineering from Birla Institute of Technology and Science - Pilani, Rajasthan, India (BITS-Pilani) in 2007, and his PhD degree in electrical engineering from the University of Minnesota, Minneapolis, in 2012. He is a research scientist with the RF/mm-wave Communication Circuits & Systems Group at IBM T. J. Watson Research Center, Yorktown Heights, NY, and an adjunct assistant professor at Columbia University. At IBM, he has led the design and demonstration of the world’s first reported silicon-based 5G phased array IC, a low power 60GHz CMOS transceiver IC for 802.11ad communications, a software-defined phased array radio, and a self-healing 25GHz low noise frequency synthesizer. He has authored and co-authored more than 15 journal papers and more than 30 conference papers, the book Cognitive Radio Receiver Front-Ends-RF/Analog Circuit Techniques (Springer, 2014), and several book chapters. He holds 57 issued U.S. patents. Sadhu serves as an IEEE MTT-S Distinguished Microwave Lecturer, the RFIC Systems & Applications sub-committee chair, a steering committee member of IEEE RFIC Symposium, TPC member of the Wireless Subcommittee at IEEE ISSCC, guest editor of IEEE TMTT, and has served as guest editor of IEEE JSSC in 2017. Sadhu is the recipient of the 2017 ISSCC Lewis Winner Award for Outstanding Paper (best paper award), the 2017 JSSC Best Paper Award, the 2017 Pat Goldberg Memorial Award for the best paper in computer science, electrical engineering, and mathematics published by IBM Research, four IBM Outstanding Technical Achievement Awards, ten IBM Patent Plateau Awards, the University of Minnesota Graduate School Fellowship in 2007, 3M Science and Technology Fellowship in 2009, the University of Minnesota Doctoral Dissertation Fellowship in 2011, the BITS Pilani Silver Medal in 2007, and stood second in India in the Indian School Certificate (ISC) examination in 2003. He was recognized as an IBM Master Inventor in 2017, and was selected by the National Academy of Engineering for its Frontiers of Engineering Symposium in 2020.

Faculty Host:Danilo Erricolo (

Student Host: Alex C. Stutts (

This lecture will be hosted online and will not be recorded. Contact the hosts for lecture link.


Department of Electrical and Computer Engineering

Date posted

Sep 22, 2021

Date updated

Sep 22, 2021