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Apr 22 2022

Development of FlexTrate(TM) and Demonstration of Flexible Heterogeneously Integrated Low Form-factor Wireless Multi-channel Surface Electromyography (sEMG) Device

ECE 595 Department Seminar Series

April 22, 2022

11:00 AM - 12:15 PM


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Development of FlexTrate(TM) and Demonstration of Flexible Heterogeneously Integrated Low Form-factor Wireless Multi-channel Surface Electromyography (sEMG) Device

Speaker: Arsalan Alam, AMD

Abstract: Leading-edge implantable applications such as neural implanted prosthetics and next-generation Internet of Things (IoT) devices require integrating high performance and low power logic, memory and sensors at high interconnect density, which is not possible using conventional printed flexible electronics. As flexible applications mature, there will be a demand that they are “smart,” which will require leading edge CMOS and RF electronics, advanced sensors, and power management. There is a need to develop a robust and flexible electronics packaging platform that will enable the unrestricted integration of high-performance, state-of-the-art components (processors, memories, sensors, data transmitters and receivers, power sources etc.) on biocompatible, flexible substrates with the ability to miniaturize, interconnect at high density with acceptable reliability, and scale-up in manufacturing at economical and cost-effective price points. Considering all the above requirements, in this work, the development of a highly flexible and reliable heterogeneous integration platform with fine interconnect pitch (≤ 40 µm) called FlexTrateTM is investigated. The fabrication and assembly processes necessary for such a platform are developed. FlexTrateTM is based on a die-first flexible Fan-Out Wafer-Level Packaging (FOWLP) approach where Polydimethylsiloxane (PDMS) is used as a molding compound to embed the heterogeneous dies and integrate them with mechanically robust vertically corrugated interconnects at 20-40 µm pad pitches without the use of solder. FlexTrateTM is demonstrated to be bendable to 1 mm bending radius for thousands of bending cycles with minimal degradation in the system’s electrical performance. The benefits to system performance and flexibility of FlexTrateTM-style integration are highlighted through three demonstrations: 200 dies integrated at 40 µm pad pitches, a foldable display, and a wearable biosensing system in the form of wireless multi-channel surface electromyography (sEMG) system. The sEMG system can be attached to the skin to record quality muscle signals through dry electrodes and can transmit data to a computer or smartphone via Bluetooth Low Energy (BLE). The ability to acquire muscle signals through our device in a mobile setting is critical for the study of many muscular physiological phenomena and disorders.

Speaker bio: Arsalan Alam is a senior packaging engineer at AMD's Advanced Packaging Group in Austin, Texas. He completed his PhD in electrical and computer engineering with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at the University of California, Los Angeles, in 2021. He holds about 20 publications and two patents, with a few patents pending. His research interests include the development of FlexTrateTM, a bio-compatible, physically flexible platform that allows for heterogeneous integration using the Fan-Out Wafer-Level Packaging (FOWLP) technique for the development of next-generation high-performance implantable and wearable applications. He was the winner of the IEEE EPS Packaging Vision Award, 2020 and recipient of the Broadcom Foundation Fellowship, 2017-2018. He was also a member of UCLA’s table tennis team from 2016-2021. Before joining UCLA, he was a visiting student researcher at King Abdullah University of Science and Technology (KAUST), Saudi Arabia. He received his bachelor’s degree in electronics and communication engineering from the Zakir Hussain College of Engineering and Technology, India, in 2011, and his master’s degree in microelectronics and VLSI from IIT Roorkee, India, in 2015.

Faculty Host: Inna Partin-Vaisband,

This event will not be recorded.


ECE Student Affairs

Date posted

Apr 22, 2022

Date updated

Apr 22, 2022