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Oct 9 2020

Developing Reliable Power Electronics

ECE 595 Department Seminar Series

October 9, 2020

11:00 AM - 12:00 PM



Chicago, IL 60607

Developing Reliable Power Electronics

Presenter: F. Patrick McCluskey, University of Maryland, College Park

Abstract: Power electronics are becoming ubiquitous in engineered systems as they replace traditional ways to control the generation, distribution, and use of energy. They are used in products as diverse as cell phone towers, hypersonic and electric aircraft, wind turbines, autonomous vehicles, smart grids, and data centers. This widespread incorporation has resulted in significant improvements in efficiency, but it also has made it essential that the reliability of power electronics be characterized and enhanced. Recently, increased power levels made possible by new compound semiconductor materials, combined with increased packaging density have led to higher heat densities in power electronic systems, especially inside the switching module, making thermal management more critical to performance and reliability of power electronics. Furthermore, today’s most challenging applications of electronics require operation in harsh environments. In this presentation, the latest work in the areas of wide bandgap semiconductor reliability, high temperature interconnection including copper wire bonding, lead-free attach material synthesis, 3D integrated thermal packaging, and advanced manufacturing of power electronics – all focused on designing, manufacturing and qualifying electronics for reliable use, will be discussed.

Speaker bio: F. Patrick McCluskey is a professor of mechanical engineering at the University of Maryland, College Park, where he is the director of the Design and Systems Reliability division. He has published extensively in the area of packaging and reliability of electronics and microsystems for high power and extreme environments, including editing and co-editing three books, and authoring over 150 technical articles and book chapters with over 3,000 citations. He is a fellow of IMAPS, where he serves as a director on the Executive Committee, in addition to being a senior member of IEEE, where he serves on the Board of Governors of the Electronic Packaging Society. He is the chair of Energy and Power Packaging subcommittee of the Electronic Packaging Society and the lead author of the Integrated Power Electronics Chapter of the 2019 IEEE Heterogeneous Integration Roadmap.

Faculty host: Sudip Mazumder,

This presentation will not be recorded


Department of Electrical and Computer Engineering

Date posted

Oct 8, 2020

Date updated

Oct 8, 2020